| 摘要 |
<P>PROBLEM TO BE SOLVED: To protect microelectromechanical systems from damage by increasing rigidity of a back-plate. <P>SOLUTION: The packaged device includes a substrate 101, an interferometric modulation display array 111 formed on the substrate 101, and a back-plate. The back-plate is placed over the display array 111 with a gap 124 between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof. A driving space is processed by drying, sealing, gas filling, etc., for the purpose of preventing interference of the operation. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
