| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide component mounting method and mounter capable of mounting an electronic component more quickly. <P>SOLUTION: After an image is picked up by a component recognition camera 6, an operation control section 77a lowers the lower surface of an electronic component C sucked by first through fourth heads 45a-45d from a recognition height to a movable height during transfer of a printed board P mounting an electronic component C sucked by a first head 45a to a region capable of head lowering operation. Since moving distance of the head 45 is shortened, lowering distance of the head 45 can be shortened at the time of mounting the electronic component resulting in reduction in time required for mounting the electronic component. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
