| 摘要 |
PROBLEM TO BE SOLVED: To manufacture fine structures with different kinds of thickness by a small number of printing steps. SOLUTION: A printing stencil 3 equipped with a lower product layer 4 and at least one lattice layer 5 and arranged on the lower product layer is mounted on the substrate surface 1 of a substrate 2. In this case, the product layer 4 has at least one lower aperture 6, while the lattice layer 5 has at least one upper aperture 7 arranged above the lower aperture 6. Inside the upper aperture 7, an intermediate material region 10 that partially covers the lower aperture 6 and extends through the upper aperture 7 is formed. Material paste is printed on the substrate surface 1 by the printing stencil 3, and the printing stencil 3 is removed. In this case, the material region printed through the apertures 6 and 7 on the substrate surface 1 remains. The material region is hardened, and a circuit region of the switching circuit is formed on the substrate surface 1. COPYRIGHT: (C)2006,JPO&NCIPI
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