| 摘要 |
PROBLEM TO BE SOLVED: To provide a processor and a processing method by which uniform plasma treatment is applied to wafers surfaces even if a batch type is used. SOLUTION: The processor includes a drive rod 13 extending in the lamination direction of the wafers 6, and a driving means 14 which drives the drive rod 13 so that the rod may get away from the wafers 6 from a boat 4 all at once, and that the boat 4 may retain different portions of peripheral directions of the wafers 6 all at once. A plurality of the wafers 6 is rotated by the drive rod 13 of the driving means 14, and the positional relation of a rotating direction between the wafers 6 and a plasma generating electrode is changed, by which a plasma density is uniformly distributed in the peripheral directions of a plurality of the wafers 6. COPYRIGHT: (C)2006,JPO&NCIPI
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