| 摘要 |
PROBLEM TO BE SOLVED: To effectively attain suppression of characteristic variations and simplify the manufacturing process by solving various problems of side mounting. SOLUTION: An input electrode layer 48 for configuring an input terminal, an output electrode layer 50 configuring an output terminal, and four shield electrode layers 52a to 52d configuring shield terminals are formed in a dielectric layer S7 being a lowermost layer to a form of via-holes in a passive component 10A. The input electrode layer 48 is electrically connected to an input resonance electrode 26 via a via-hole 54 formed in the vicinity of a second side face 14b of a dielectric substrate 14 over fourth to sixth dielectric layers S4 to S6 and via an input tap electrode 30. The output electrode layer 50 is electrically connected to an output resonance electrode 28 via a via-hole 56 formed in the vicinity of a third side face 14c of the dielectric substrate 14 over the fourth to sixth dielectric layers S4 to S6 and via the output tap electrode 32. COPYRIGHT: (C)2006,JPO&NCIPI
|
