| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit material which uses conductive paste that is excellent in low-temperature rapid curing performance with heat resistance, moisture resistance, thermal shock resistance, and bending resistance, and shows excellent bonding characteristics to an organic film, a metal substrate, a glass substrate or the like. SOLUTION: The conductive paste contains conductive powder (A), and polyester resin (B) in which a monomer is copolymerized having double bond for 0.5-50 mol% of an acid component and/or a glycol component, when the total of the acid component and the glycol component of polyester resin assumed is set as 100 mol%. It also contains an isocyanate compound (C). COPYRIGHT: (C)2006,JPO&NCIPI
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