| 摘要 |
This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component ( 6 ) is attached to the surface of a conductive layer and electrical and electrical contacts are formed between the contact zones of the component ( 6 ) and the conductive layer. After this, an insulating-material layer ( 1 ), which surrounds the component ( 6 ) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After this, conductive patterns ( 14 ) are formed from the conductive layer, to which the component ( 6 ) is attached.
|
