发明名称 Apparatus for and method of cooling molded electronic circuits
摘要 An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.
申请公布号 US2006076124(A1) 申请公布日期 2006.04.13
申请号 US20050220811 申请日期 2005.09.06
申请人 SHARIFIPOUR BAHMAN;JANSEN ARIAN 发明人 SHARIFIPOUR BAHMAN;JANSEN ARIAN
分类号 F28D15/00 主分类号 F28D15/00
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