SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD

摘要

A substrate treatment apparatus having a fluid supply means (35) for supplying fluid to a substrate (W), a fluid suction section (35a) opened near a fluid jetting section (36a) of the fluid supply means (35), and a fluid recovery means (36) for recovering the fluid near the substrate (W). Fluid caused to float near the substrate by jetting of the liquid from the fluid jetting section to the substrate is sucked and recovered by the fluid recovery means, and this suppresses contamination of the substrate after the substrate is treated by the fluid supplied by the fluid supply means.