| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity which is developable to obtain a pattern of high resolution and a high film retention rate, which is curable at a low temperature, which has superior mechanical characteristics, adhesiveness, and water absorption property as the film characteristics, after being cured, and to provide a semiconductor device, in particular, a semiconductor device having a lead-on-chip structure by using the composition. <P>SOLUTION: The photosensitive resin composition comprises (A) a cyclic olefin resin having an epoxy group, (B) a photoacid generator, and (C) filler. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
