| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate sealing structure wherein the shortcircuiting of a circuit due to dispersion of solder is prevented in high reliability without making a circuit substrate larger in size. SOLUTION: In the state where a circuit substrate 2 is arranged within an enclosure 1, the enclosure 1 is filled with a filling resin 3 (having fluidity before curing), and the filling resin 3 is cured, thus making such a structure (substrate sealing structure) that the substrate 2 is wrapped by the filling resin 3. In this case, an opening 10 is formed between adjoining circuit patterns 4 and 5 connected by solder on the circuit substrate 2, and the filling resin 3 enters the opening 10 to fill it. COPYRIGHT: (C)2006,JPO&NCIPI
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