METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which improves a driving force at a conduction time. SOLUTION: The method of manufacturing the semiconductor device includes steps of: forming a predetermined groove 15 to one principal surface side of a semiconductor substrate having a substrate 1 and a drain region 2; forming an embedding region 11 in contact with at least the side wall of the groove 15 so that this groove 15 is protruded; forming a hetero semiconductor layer 30 so that the semiconductor substrate and the embedding region 11 are attached; and forming the hetero semiconductor region 3 by patterning the hetero semiconductor layer 30. COPYRIGHT: (C)2006,JPO&NCIPI