| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board improving migration-resistant properties as well as preventing such a defect as a short circuit or the like, and also to provide a manufacturing method therefor. SOLUTION: Connection parts 11a are formed of a conductive material containing an Ni filler plated with Au and do not contain an Ag filler. Each connection terminal 100a is electrically connected to each connection part 11a via a conductive adhesive 13, and thereby an electric component 100 is mounted on an insulating substrate 10a. This makes the circuit board more resistant to a migration phenomenon in use of the circuit board compared with a case where each connection part 11a is formed of a conductive material containing the Ag filler. As a result, the poor insulation by an insulator in the circuit board is prevented, and eventually the defect of the circuit board due to the short circuit between the connection parts 11a is prevented. COPYRIGHT: (C)2006,JPO&NCIPI
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