| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a wiring pattern excellent in the reliability of an electric connection. SOLUTION: The method of forming the wiring pattern made by performing mutually conduction connection of a plurality of electric wiring 32, 36 laminated and arranged through an interlayer dielectric 54 by a conduction post 34 includes a step of drawing forming a liquid-like post 34p to the forming position of the conduction post 34 by discharging first liquid drop containing the constitution material of the conduction post 34, a step of drawing forming the liquid-like post 34p at the forming position of the conduction post 34, and a step of drawing forming a liquid-like interlayer film 54p to the region except the forming position of the conduction post 34 by discharging second liquid droplet containing the constitution material of the interlayer dielectric 54. The first liquid drop and the second liquid drop are constituted by the materials showing phase separation nature from one another. COPYRIGHT: (C)2006,JPO&NCIPI
|
