| 摘要 |
PROBLEM TO BE SOLVED: To prevent an adhesive from flowing into a channel along the corner part of a substrate when the substrate is bonded to a chip plate. SOLUTION: The ink-jet head is composed so that a member for preventing an inflow of an adhesive is provided to at least a part of an ink supply path before bonding the substrate. The ink-jet head is manufactured by using the manufacturing method. COPYRIGHT: (C)2006,JPO&NCIPI
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