发明名称 High mobility plane CMOS SOI
摘要 Disclosed is an integrated circuit structure that has a substrate having at least two types of crystalline orientations. First-type transistors (e.g., NFETs) are formed on first portions of the substrate having a first type of crystalline orientation, and second-type transistors (e.g., PFETs) are formed on second portions of the substrate having a second type of crystalline orientation. Some of the first portions of the substrate comprise non-floating substrate portions, and the remaining ones of the first portions and all of the second portions of the substrate comprise floating substrate portions.
申请公布号 US2006076623(A1) 申请公布日期 2006.04.13
申请号 US20050270708 申请日期 2005.11.09
申请人 ANDERSON BRENT A;LEONG MEIKEI;NOWAK EDWARD J 发明人 ANDERSON BRENT A.;LEONG MEIKEI;NOWAK EDWARD J.
分类号 H01L27/08;H01L27/12;H01L21/336;H01L21/762;H01L21/82;H01L21/8238;H01L21/84;H01L27/02;H01L27/092;H01L27/10;H01L29/786;H01L29/788 主分类号 H01L27/08
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