| 发明名称 |
Selective capping of copper wiring |
| 摘要 |
Patterned copper structures are fabricated by selectively capping the copper employing selective etching and/or selective electroplating in the presence of a liner material. Apparatus for addressing the problem of an increased resistive path as electrolyte during electroetching and/or electroplating flows from the wafer edge inwards is provided.
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| 申请公布号 |
US2006076685(A1) |
申请公布日期 |
2006.04.13 |
| 申请号 |
US20050265302 |
申请日期 |
2005.11.03 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES |
发明人 |
ANDRICACOS PANAYOTIS C.;CHEN SHYNG-TSONG;COTTE JOHN M.;DELIGIANNI HARIKLIA;KRISHNAN MAHADEVAIYER;TSENG WEI-TSU;VEREECKEN PHILIPPE M. |
| 分类号 |
H01L23/48;H01L21/00;H01L21/288;H01L21/768 |
主分类号 |
H01L23/48 |
| 代理机构 |
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