发明名称 BOND TYPE DIODE UTILIZING TIN-DOPED GALLIUM ARSENIDE
摘要 A bond type diode which is composed of gallium arsenide doped with tin within the range of 1 x 1016 to 5 x 1017 atoms/cm3, preferably about 3 x 1017 atoms/cm3, of a gold wire containing zinc welded onto a portion of a surface of the tin-doped gallium arsenide, and of an electrode in ohmic contact with the tin-doped gallium arsenide at a portion different from the welded portion.
申请公布号 US3660734(A) 申请公布日期 1972.05.02
申请号 USD3660734 申请日期 1969.09.09
申请人 HITACHI LTD. 发明人 SHINYA IIDA;HITOSHI SATO;YUTAKA TAKEDA
分类号 H01L29/872;H01L29/00;H01L29/207;H01L29/41;H01L29/47;(IPC1-7):H01L11/00;H01L15/00 主分类号 H01L29/872
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