Wafer`s structured sample upper surface testing method for Dynamic RAM production, involves finding distance of surface area from flying time of ions from surface to verification device, and receiving result indicating surface portion

摘要

The method involves accelerating secondary ions of a secondary ion beam into an electrical field. A dimension is determined from a flying time of secondary ions from a sample upper surface (10) of a wafer to a verification device, where the dimension is the distance of the area of the upper surface. A result is received, which indicates a portion of the upper surface with a specific distance to the reference surface. An independent claim is also included for a device for testing a structured sample upper surface.