| 摘要 |
PROBLEM TO BE SOLVED: To provide the heat dissipation structure of a printed wiring board capable of improving heat dissipation performance. SOLUTION: The printed wiring board 1A with a circuit pattern 4 formed at least on one surface thereof includes the heat dissipator 5A of a heating component 2 provided in the circuit pattern 4. The heat dissipator 5A comprises a first heat dissipation pattern 6 wherein the pattern of a part of the circuit pattern 4 is expanded and formed to which an electrode of the heating component 2 is connected; a second heat dissipation pattern 7 having a size substantially coincident with the first heat dissipation pattern 6, while facing the first heat dissipation pattern 6 and formed on the other surface of the printed wiring board 1A; and a through hole 9 penetrating the printed wiring board 1A in a region where the first heat dissipation pattern 6 and the second heat dissipation pattern 7 are existent, and including an electric conductor disposed on the internal peripheral surface of the printed wiring board to electrically connect the first heat dissipation pattern part 6 and the second heat dissipation pattern part 7. The through hole 9 is formed into an elongated hole shape or an elliptic shape. COPYRIGHT: (C)2006,JPO&NCIPI |
