发明名称 GRINDING METHOD FOR LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a grinding method for a laminate which can prevent a substrate from being damaged by fragments of a plate-like object occurring at the time of grind-cutting the plate-like object of a laminate which is made by joining the plate-like object to the substrate with an extremely narrow gap part left in-between. SOLUTION: When grind-cutting the plate-like object by cutting with a grinding stone into the gap part of the laminate made by joining the substrate and the plate-like object with the gap part left in-between, a protection layer for the substrate is formed in advance in the gap part to prevent the substrate from being damaged by the fragments of the plate-like object occurring during the grinding operation. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006100586(A) 申请公布日期 2006.04.13
申请号 JP20040285100 申请日期 2004.09.29
申请人 FUJI PHOTO FILM CO LTD;FUJI FILM MICRODEVICES CO LTD 发明人 WATANABE MANJIRO;NEGISHI YOSHIHISA;MAEDA HIROSHI;SHIMAMURA HITOSHI
分类号 H01L21/301;B24B27/06 主分类号 H01L21/301
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