发明名称 |
GRINDING METHOD FOR LAMINATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a grinding method for a laminate which can prevent a substrate from being damaged by fragments of a plate-like object occurring at the time of grind-cutting the plate-like object of a laminate which is made by joining the plate-like object to the substrate with an extremely narrow gap part left in-between. SOLUTION: When grind-cutting the plate-like object by cutting with a grinding stone into the gap part of the laminate made by joining the substrate and the plate-like object with the gap part left in-between, a protection layer for the substrate is formed in advance in the gap part to prevent the substrate from being damaged by the fragments of the plate-like object occurring during the grinding operation. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006100586(A) |
申请公布日期 |
2006.04.13 |
申请号 |
JP20040285100 |
申请日期 |
2004.09.29 |
申请人 |
FUJI PHOTO FILM CO LTD;FUJI FILM MICRODEVICES CO LTD |
发明人 |
WATANABE MANJIRO;NEGISHI YOSHIHISA;MAEDA HIROSHI;SHIMAMURA HITOSHI |
分类号 |
H01L21/301;B24B27/06 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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