发明名称 |
RIGID-FLEXIBLE SUBSTRATE AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a rigid-flexible substrate in which flexibility and elasticity of a flexible part is not impaired even if wiring density is increased, which comprises a simple process, and which provides a high material yield and a high product yield. SOLUTION: A rigid substrate having a vertical wiring formed in a joint region and a flexible substrate having a connection terminal formed at an end are separately manufactured. Positions of the rigid substrate corresponding to the edges of both surfaces of the flexible substrate are spot faced equally to or deeper than the thickness of the flexible substrate to form steps. The connection terminal of each one end of two flexible substrates is connected to the vertical wiring of the step. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006100704(A) |
申请公布日期 |
2006.04.13 |
申请号 |
JP20040287147 |
申请日期 |
2004.09.30 |
申请人 |
DAINIPPON PRINTING CO LTD;DT CIRCUIT TECHNOLOGY CO LTD |
发明人 |
KOBAYASHI ATSUSHI;UMEDA KAZUO;SAWARA TAKAHIRO;NAKAZAWA SUSUMU |
分类号 |
H05K3/46;H05K1/14;H05K3/36 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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