| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed-wiring board capable of accurately forming the place of the circuit pattern of the next layer by using an alignment mark in response to a previously formed circuit pattern. SOLUTION: The problem can be solved by using a transmitted light having a wavelength of 600 nm or more as a confirming light for a through-hole used as the alignment mark previously formed on a substrate in the case of an alignment in the manufacturing method for the multilayer printed-wiring board. COPYRIGHT: (C)2006,JPO&NCIPI |
