| 摘要 |
PROBLEM TO BE SOLVED: To make a void generated between a circuit board and a semiconductor chip disappear in a method for manufacturing an electronic component by injecting underfill resin into a gap between the circuit board and the semiconductor chip. SOLUTION: A workpiece is put in a furnace capable of performing required temperature control, and curing the underfill resin 3 having an oxide film removing effect also by using the furnace capable of holding its inside at vacuum atmosphere for manufacturing the electronic component. The manufacturing method comprises a process for previously applying the underfill resin 3 to the circuit board 4 in a process for mounting many semiconductor elements having solder bumps 2 to be electrically connected to the circuit board 4; a process for aligning the semiconductor chip 1 with the circuit board 4 having pads 5 corresponding to the solder bumps 2 on the semiconductor chip 1; a process for pressurizing the semiconductor chip 1 and the circuit board 4 in contact, and heating and curing the underfill resin 3; and a process for generating pressure reducing atmosphere at least once or more in the curing process. COPYRIGHT: (C)2006,JPO&NCIPI
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