| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin-based adhesive composition that has high adhesive strength, excellent heat resistance, weather resistance, good handleability and workability because of low viscosity. SOLUTION: This adhesive composition comprises a copolymer that includes an epoxy group-bearing monomer unit and an epoxy group-free (meth)acrylic ester unit with the weight-average molecular weight of 500 to 5,000 and an epoxy resin. The copolymer is preferably prepared by continuously polymerizing the starting monomers at a temperature of 150 to 350°C. COPYRIGHT: (C)2006,JPO&NCIPI
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