发明名称 SUBSTRATE PROCESSING METHOD AND APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing method and an apparatus therefor whereby bubbles are so removed as to be able to reduce the particles stuck on a substrate. SOLUTION: The substrate processing method has a process for so dipping a substrate in the processing liquid stored in an internal vessel 11 as to generate a large amount of micro bubbles Mb, and has a process for so feeding a nitrogen gas on the surface of the processing liquid by a nitrogen-gas nozzle 26 in the state of dipping the substrate in the processing liquid as for the nitrogen gas to guide the bubbles Mb present on the surface of the processing liquid from the internal vessel 11 to an external vessel 12. Consequently, the bubbles Mb can be removed from the internal vessel 11 because the nitrogen gas guides the bubbles Mb to the outside of the internal vessel 11. Also, when pulling up the substrate from the processing liquid of the internal vessel 11, the particles stuck on the substrate can be reduced since the bubbles Mb are guided to the external vessel 12 while the substrate is dipped in the processing liquid. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006100717(A) 申请公布日期 2006.04.13
申请号 JP20040287523 申请日期 2004.09.30
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 NISHIMURA TAKASHI;TOMITA TAKESHI;SUDO YOSHIHIKO
分类号 H01L21/304;B08B3/10;G02F1/1333;G11B7/26;H01L21/306 主分类号 H01L21/304
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