| 摘要 |
PROBLEM TO BE SOLVED: To prevent an adhesive 9 from spreading to the tip side of a terminal plate 3 at temporary bonding the terminal plate to a margin frame 6 using an adhesive 9 when the terminal plate is soldered to a hybrid circuit board, relating to a material board in which, with the margin frame 6 provided between the hybrid circuit boards, a plurality of hybrid circuit boards 1 on which an electronic component 2 is mounted and the metal terminal plate 3 for connecting to the outside is so bonded as to protrude are integrally formed with the margin frame through a narrow piece 8 provided in the middle of a cut-out slot 7 enclosing the entire periphery of the hybrid circuit board. SOLUTION: A through hole 10 or a recess is provided to a part to the tip side closer than to a point where an adhesive 9 for temporary bonding to the margin frame of the terminal plate is applied among margin frames 6 at a area where the terminal plate 3 overlaps with a margin frame. COPYRIGHT: (C)2006,JPO&NCIPI |
