发明名称 METHOD AND DEVICE FOR MOUNTING CONDUCTIVE BALL
摘要 PROBLEM TO BE SOLVED: To provide an improved mounting method and a device for mounting conductive balls on an array in a predetermined pattern. SOLUTION: The mounting method, in which the conductive balls are mounted on one surface of the array in a predetermined pattern, comprises a first step of positioning an alignment member which is provided with one surface and the other surface facing the one surface, and a positioning opening part which is arranged corresponding to the pattern, is opened to the one surface and the other surface, and allows the balls to be inserted therein, so that the other surface of the alignment member faces to one surface of the array, and a second step of horizontally moving a transfer device, which is provided with two or more linear members disposed with the axes cores thereof substantially aligned, and is disposed so that the linear members are allowed to abut on the balls fed to one surface of the alignment member in a substantially horizontal position, so that the transfer device is moved horizontally relative to one surface of the alignment member. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006100854(A) 申请公布日期 2006.04.13
申请号 JP20050343597 申请日期 2005.11.29
申请人 HITACHI METALS LTD 发明人 ITO MOTOMICHI;OCHIAI MASANORI;WAI SHINICHI
分类号 H01L21/60;H05K3/34 主分类号 H01L21/60
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