| 摘要 |
A method for producing an optical or electronic module provided with a plastic package in which at least one optical or electronic component having an operative region is encapsulated with at least one polymer compound to form the plastic package. Portions of the polymer compound are then removed by a device, such as a laser, in such a way that an opening is defined in the polymer compound between the operative region of the component and the outer side of the plastic package. A functional structure is then introduced into the remaining polymer compound by the device.
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