发明名称 Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film
摘要 The present invention relates to a photocurable resin composition, wherein the composition comprises:(A) a polyimide resin having one or more primary alcoholic groups with an alcoholic equivalent equal to or less than 3500, said polyimide being soluble in an organic solvent and having a weight average molecular weight of from 5,000 to 500,000; (B) at least one selected from the group consisting of a condensate of an amino compound modified with formalin, optionally further with alcohol, preferably a melamine resin modified with formalin, optionally further with alcohol, and a urea resin with formalin, optionally further with alcohol, and a phenolic compound having, on average, at least two selected from the group consisting of a methylol group and an alkoxy methylol group, and (C) a photoacid generator capable of generating an acid upon irradiation with light of a wavelength of from 240 nm to 500 nm.
申请公布号 US2006079658(A1) 申请公布日期 2006.04.13
申请号 US20050245019 申请日期 2005.10.07
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 KATO HIDETO;SUGO MICHIHIRO;GOTO TOMOYUKI
分类号 C08G77/00 主分类号 C08G77/00
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