发明名称 |
Temperature measuring device using a matrix switch, a semiconductor package and a cooling system |
摘要 |
An embodiment relates to a temperature measuring device using a matrix switch, and a semiconductor package. In another embodiment a cooling system may be included. A plurality of temperature sensors may be arranged on a surface of a semiconductor device. The matrix switch may select the temperature sensors by an address method to form a circuit that includes the selected temperature sensor. A measuring unit may receive an output signal of the selected temperature sensor to calculate the temperature at the selected temperature sensor.
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申请公布号 |
US2006075760(A1) |
申请公布日期 |
2006.04.13 |
申请号 |
US20050217597 |
申请日期 |
2005.08.31 |
申请人 |
IM YUN-HYEOK;KANG SUK-CHAE;LEE HEE-SEOK |
发明人 |
IM YUN-HYEOK;KANG SUK-CHAE;LEE HEE-SEOK |
分类号 |
F25B21/02;F24F7/00;F25D23/12;H01L35/28 |
主分类号 |
F25B21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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