发明名称 |
SOLDER RESIST COATING, CURED PRODUCT THEREFROM AND PRINTED WIRING BOARD HAVING COATING FILM THEREFROM |
摘要 |
<p>A two component solder resist coating wherein a first component comprising a partial hydrolyzate of an alkoxysilane compound and an organic solvent and a second component comprising a titanium alkoxide and an organic solvent are mixed and cured, characterized in that the first component and/or the second component contain a potassium titanate fiber; a solder resist cured product formed from the coating; and a printed wiring board having a coating film prepared by forming a pattern using the coating and then curing the pattern. Said solder resist coating may further contain, in the first component and/or the second component, at least one selected from among a kaolin powder, an alumina powder and an aluminum hydroxide powder having been treated with a coupling agent, a fumed silica powder having been subjected to a surface treatment for imparting hydrophobicity, an ethyl cellulose powder, a blue pigment containing no halogen atom and/or a yellow pigment containing no halogen atom.</p> |
申请公布号 |
WO2006038262(A1) |
申请公布日期 |
2006.04.13 |
申请号 |
WO2004JP14369 |
申请日期 |
2004.09.30 |
申请人 |
CERAMISSION CO., LTD.;TAKEMOTO, MASAKAZU;NAITO, TAKASHI;KANEKO, RYUZO |
发明人 |
TAKEMOTO, MASAKAZU;NAITO, TAKASHI;KANEKO, RYUZO |
分类号 |
(IPC1-7):C09D185/00;H05K3/28 |
主分类号 |
(IPC1-7):C09D185/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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