| 摘要 |
The device has a container (1) holding a number of substrate wafers, supplied with a treatment fluid for the latter via a nozzle system with a number of nozzles (7), for providing a uniform laminar flow pattern within the container. The nozzles may have different spray angles (8,9) and are arranged in a matrix pattern across the base of the container, with some nozzles providing a fan-shaped spray while the others provide a conical spray. |
