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发明名称
Method of manufacturing a dual damascene interconnect
摘要
申请公布号
EP1435656(A3)
申请公布日期
2006.04.12
申请号
EP20030025373
申请日期
2003.11.04
申请人
CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
发明人
WUPING, LIU;TAN, JUAN BOON;ZHANG, BEI CHAO;CUTHBERTSON, ALAN
分类号
H01L21/768
主分类号
H01L21/768
代理机构
代理人
主权项
地址
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