| 摘要 |
A semiconductor unit which comprises one or more semiconductor elements in disc form assembled between two clamping members which are drawn towards each other by means of clamping bolts which pass through the clamping members and terminate in a bridging yoke. Tightening of the bolts moves the yoke in the direction of the clamping members and this movement is transmitted to one of the clamping members by way of spring means thereby to apply pressure to the semiconductor element. The spring means is provided to allow for movement of the clamping members at they heat up and expand during operation of the semiconductor unit. |
