| 摘要 |
A resin-encapsulated package includes a semiconductor IC chip, in which the ratio of the size of the semiconductor IC chip to the package size of the resin-encapsulated package including the semiconductor IC chip is large to miniaturize the resin-encapsulated package. The resin-encapsulated package is capable of dealing with increase in the operating speed of the semiconductor IC chip. The resin-encapsulated package includes a semiconductor IC chip (110) sealed in a resin molding, and a lead member (130B) having an arrangement of a plurality of discrete terminal sections (130A). Each of the terminal sections has inner terminal parts (131) to be electrically connected to terminals (115) of the semiconductor IC chip, outer terminal parts (132) to be connected to external circuits, and connecting parts(133) interconnecting the inner and the outer terminal parts. The inner and the outer terminal parts are formed such that the contact surfaces of the inner terminal parts and those of the outer terminal parts face toward opposite directions, respectively. The inner terminal parts and the connecting parts are thin, and the outer terminal parts are thick. The contact surfaces (131S) of the inner terminal parts of the terminal sections are flush with each other. A terminal-side surface of the semiconductor IC chip on the side of the terminals faces a surface of the lead member on the side of the contact surfaces of the inner terminal parts. The terminals of the semiconductor IC chip are joined to or in contact with the contact surfaces of the inner terminal parts of the lead member, and the terminals of the semiconductor IC chip are connected electrically to the inner terminal parts of the lead member. <IMAGE> |
