发明名称 |
HARDENABLE COMPOSITION, HARDENING PRODUCT, PROCESS FOR PRODUCING THE SAME AND LIGHT EMITTING DIODE SEALED WITH THE HARDENING PRODUCT |
摘要 |
The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. <??>A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition. |
申请公布号 |
EP1505121(A4) |
申请公布日期 |
2006.04.12 |
申请号 |
EP20030725638 |
申请日期 |
2003.04.23 |
申请人 |
KANEKA CORPORATION |
发明人 |
TSUMURA, MANABU;IDE, MASAHITO;OUCHI, KATSUYA;KURAMOTO, MASAFUMI,;MIKI, TOMOHIDE,;NII, IKUYA, |
分类号 |
C08F8/00;C08F8/42;C08G77/42;C08G77/50;C08G77/54;C08K5/54;C08L63/00;C08L83/00;C08L83/05;C08L83/10;C08L83/14;H01L33/56;(IPC1-7):C08L83/05;H01L33/00;C08K5/057;H01L23/29;C08K5/55;C08K5/541 |
主分类号 |
C08F8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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