发明名称 |
Electrical circuit comprising a multilayer circuit board |
摘要 |
<p>The electric circuit has parts of at least an outer layer (1) formed as contact surfaces (6). These are each connected to respective conductor surfaces on a further layer (2,3). This further layer has a flat area offset relative to the contact surfaces. This offset layer form, together with the opposing earthed surface (5) the outer layer (1) of a feedthrough capacitor.</p> |
申请公布号 |
EP1646269(A2) |
申请公布日期 |
2006.04.12 |
申请号 |
EP20050108651 |
申请日期 |
2005.09.20 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BERBERICH, REINHOLD;BUSCH, DIETER;ZINTLER, ALBERT |
分类号 |
H05K1/11;H05K1/02;H05K1/16;H05K3/36;H05K9/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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