发明名称 Electrical circuit comprising a multilayer circuit board
摘要 <p>The electric circuit has parts of at least an outer layer (1) formed as contact surfaces (6). These are each connected to respective conductor surfaces on a further layer (2,3). This further layer has a flat area offset relative to the contact surfaces. This offset layer form, together with the opposing earthed surface (5) the outer layer (1) of a feedthrough capacitor.</p>
申请公布号 EP1646269(A2) 申请公布日期 2006.04.12
申请号 EP20050108651 申请日期 2005.09.20
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BERBERICH, REINHOLD;BUSCH, DIETER;ZINTLER, ALBERT
分类号 H05K1/11;H05K1/02;H05K1/16;H05K3/36;H05K9/00 主分类号 H05K1/11
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