发明名称 |
Interconnection for organic devices |
摘要 |
A device having bond pads within a bond pad region, the bond pads comprising a conductive material that is stable when exposed to atmospheric constituents. The bond pads can be formed from conductive oxide materials such as indium tin oxide. A contact layer is provided to enhance the conductivity between the bond pads and the active component of the device.
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申请公布号 |
US7026660(B2) |
申请公布日期 |
2006.04.11 |
申请号 |
US20030249625 |
申请日期 |
2003.04.25 |
申请人 |
OSRAM OPTO SEMICONDUCTORS (MALAYSIA) SDN. BHD |
发明人 |
GUENTHER EWALD;LIM HOOI BIN;ABDUL MANAF SHAHROL IZZANNI;EIGENBRODT STEFAN;TENG SOONG LIN |
分类号 |
H01L33/00;H01L27/15;H01L27/32;H01L35/24;H01L51/00;H01L51/52 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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