发明名称 |
Extended thin film capacitor (TFC) |
摘要 |
Extending high k material of a second dielectric layer to surround at least one thru-via designed to provide a signal other than a power signal to a die may eliminate discrete AC coupling capacitors to reduce cost and improve performance of the package.
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申请公布号 |
US7027289(B2) |
申请公布日期 |
2006.04.11 |
申请号 |
US20040808489 |
申请日期 |
2004.03.25 |
申请人 |
INTEL CORPORATION |
发明人 |
HE JIANGQI;SUN PING;KIM HYUNJUN;ZENG XIANG YIN |
分类号 |
H01G4/228;H01L23/498;H01L23/50;H05K1/00;H05K1/03;H05K1/16 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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