发明名称 High radiance led chip and a method for producing same
摘要 The invention concerns a light-emitting diode chip ( 1 ) comprising a radiation-emitting active region ( 32 ) and a window layer ( 2 ). To increase the luminous efficiency, the cross-sectional area of the radiation-emitting active region ( 32 ) is smaller than the cross-sectional area of the window layer ( 2 ) available for the decoupling of light. The invention is further directed to a method for fabricating a lens structure on the surface of a light-emitting component.
申请公布号 US7026657(B2) 申请公布日期 2006.04.11
申请号 US20030258154 申请日期 2003.08.11
申请人 OSRAM GMBH 发明人 BOGNER GEORG;KUGLER SIEGMAR;NIRSCHL ERNST;OBERSCHMID RAIMUND;SCHLERETH KARL-HEINZ;SCHOENFELD OLAF;STATH NORBERT;NEUMANN GERALD
分类号 H01L21/00;H01L33/02;H01L33/08;H01L33/14;H01L33/20;H01L33/44 主分类号 H01L21/00
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