发明名称 Planarizing method for forming FIN-FET device
摘要 A method for forming a FIN-FET device employs a blanket planarizing layer formed upon a blanket topographic gate electrode material layer. The blanket planarizing layer is patterned and employed as a mask layer for patterning the blanket topographic gate electrode material layer to form a gate electrode. Since the blanket planarizing layer is formed as a planarizing layer, a photoresist layer formed thereupon is formed with enhanced resolution. As a result, the gate electrode is also formed with enhanced resolution. A resulting FIN-FET structure has the patterned planarizing layer formed in an inverted "U" shape upon the gate electrode.
申请公布号 US7026195(B2) 申请公布日期 2006.04.11
申请号 US20040851376 申请日期 2004.05.21
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHENG CHUNG-LONG;THEI KONG-BENG
分类号 H01L21/00;H01L21/302;H01L21/3213;H01L21/336;H01L29/423;H01L29/76;H01L29/786 主分类号 H01L21/00
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