发明名称 Assembly device comprising several transport lines for substrates to be assembled
摘要 Substrates can be transported on a top transporting section to component-fitting locations of a component-fitting apparatus. Conveying sections for substrates which are to be routed past the component-fitting locations are arranged on a number of conveying levels beneath the transporting section.
申请公布号 US7024759(B2) 申请公布日期 2006.04.11
申请号 US20020149705 申请日期 2002.10.25
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BARNOWSKI FRANK;MEHDIANPOUR MOHAMMED
分类号 B23P19/00;H05K13/02;H05K13/00 主分类号 B23P19/00
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