发明名称 |
Assembly device comprising several transport lines for substrates to be assembled |
摘要 |
Substrates can be transported on a top transporting section to component-fitting locations of a component-fitting apparatus. Conveying sections for substrates which are to be routed past the component-fitting locations are arranged on a number of conveying levels beneath the transporting section.
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申请公布号 |
US7024759(B2) |
申请公布日期 |
2006.04.11 |
申请号 |
US20020149705 |
申请日期 |
2002.10.25 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BARNOWSKI FRANK;MEHDIANPOUR MOHAMMED |
分类号 |
B23P19/00;H05K13/02;H05K13/00 |
主分类号 |
B23P19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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