发明名称 Connecting material and mounting method which uses same
摘要 A connecting material containing a thermosetting resin has a surface tension of 25 to 40 mN/m (at 25° C.). The connecting material contains a surfactant to adjust the surface tension to 25 to 40 mN/m (at 25° C.). The surfactant is a silicone resin-based surfactant or a fluorine resin-based surfactant. The ratio of surfactant content is 0.01 to 5.0 wt pts per 100 wt pts resin content in the connecting material.
申请公布号 US7025852(B2) 申请公布日期 2006.04.11
申请号 US20030439180 申请日期 2003.05.16
申请人 SONY CHEMICALS CORPORATION 发明人 KUMAKURA HIROYUKI
分类号 H01L21/52;C09J9/02;C09J201/00;H01L21/60 主分类号 H01L21/52
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