发明名称 |
Connecting material and mounting method which uses same |
摘要 |
A connecting material containing a thermosetting resin has a surface tension of 25 to 40 mN/m (at 25° C.). The connecting material contains a surfactant to adjust the surface tension to 25 to 40 mN/m (at 25° C.). The surfactant is a silicone resin-based surfactant or a fluorine resin-based surfactant. The ratio of surfactant content is 0.01 to 5.0 wt pts per 100 wt pts resin content in the connecting material.
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申请公布号 |
US7025852(B2) |
申请公布日期 |
2006.04.11 |
申请号 |
US20030439180 |
申请日期 |
2003.05.16 |
申请人 |
SONY CHEMICALS CORPORATION |
发明人 |
KUMAKURA HIROYUKI |
分类号 |
H01L21/52;C09J9/02;C09J201/00;H01L21/60 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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