发明名称 |
Reinforcement of glass substrates in flexible devices |
摘要 |
A reinforcement technique used in the fabrication of displays, such as organic light emissive diode (OLED) display, is disclosed. A stiff reinforcement lid is mounted on a thin substrate to encapsulate the OLED cells. The lid serves to reinforce the thin flexible substrate and protect it from breakage. It comprises preferably of metal or other materials that have higher stiffness and ductility than the thin substrate. The fabricated display is compatible for integration into chip cards and other flexible applications.
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申请公布号 |
US7026758(B2) |
申请公布日期 |
2006.04.11 |
申请号 |
US20010968165 |
申请日期 |
2001.09.28 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
GUENTHER EWALD;SOO ONG KIAN |
分类号 |
H05B33/04;H01L27/32;H01L51/52 |
主分类号 |
H05B33/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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