发明名称 |
Method for adhering substrates using light activatable adhesive film |
摘要 |
<p>The present invention provides a method of connecting substrates using light activatable film while preventing the deterioration of the substrate in the process. The present invention also provides a method for connecting circuits which includes irradiating a light activatable adhesive film, contacting the first surface of the activated anisotropically conductive adhesive film with the circuit on a first substrate, contacting the circuit on a second substrate with the second surface of said activated anisotropically conductive adhesive film, and compression bonding these substrates.</p> |
申请公布号 |
HK1061406(A1) |
申请公布日期 |
2006.04.07 |
申请号 |
HK20040102380 |
申请日期 |
2004.03.31 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
HIROAKI YAMAGUCHI;TETSU KITAMURA |
分类号 |
B32B7/12;B32B27/08;C08G59/18;C08J5/12;C08L63/00;C09J5/00;C09J5/06;C09J7/00;C09J9/02;C09J163/00;C09J201/00;H01L21/60;H05K3/32;(IPC1-7):C09J |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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