MANUFACTURING METHOD OF PACKAGE SUBSTRATE USING ELECTROLESS NICKEL PLATING

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a package substrate which can realize a high density fine circuit pattern by preventing undercut formed by VIA open and flash etching. SOLUTION: The method comprises: a stage of manufacturing a base substrate in which an internal layer circuit pattern is formed by a designated masking process; a stage of forming an insulating layer, performing interlayer electrical insulation, on the base substrate; a stage of forming VIA hole performing interlayer electrical conduction with respect to the insulating layer; a stage of forming seed layer on the insulating layer in which the VIA hole has been formed; and a stage of forming an external layer circuit pattern on the seed layer by the designated masking process. The seed layer is partially and selectively processed in the flash etching in order to prevent the undercut occurring in the VIA open and the external layer circuit pattern. COPYRIGHT: (C)2006,JPO&NCIPI