发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board with built-in thermocouples for easily preventing malfunction or operation stoppage owing to heat of an IC chip mounted on a wiring board and maintaining stable characteristics with respect to the treatment of specimens flowing through flow paths. SOLUTION: This wiring board is equipped with an insulation substrate made by layering a plurality of insulation layers 1 made of glass ceramics, wire conductors 3 formed between the layers of the insulation layers 1 and on surfaces of the insulation layers 1, a through conductor 4 formed through the insulation layers 1, the flow paths 9 formed in the insulation layers 1, and the thermocouples 5 electrically connected to the wire conductors 3 or to the through conductor 4. A metal layer 2, made of a metal whose sintering temperature is lower than that of the insulation layers 1, is formed between the flow paths 9 and the thermocouples 5. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006090911(A) 申请公布日期 2006.04.06
申请号 JP20040278638 申请日期 2004.09.27
申请人 KYOCERA CORP 发明人 SATO SHINGO;INUYAMA SHIGETOSHI
分类号 G01N37/00;C12M1/00;C12N15/09 主分类号 G01N37/00
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