发明名称 Semiconductor package including light emitter and IC
摘要 The is to disclose a semiconductor package featuring inclusion of light emitter(s) providing light to indicate the states of the semiconductor package as a whole and/or the chip(s) therein. The light emitter is in an original state or flashing state or emitting state according to the states of the semiconductor package as a whole and/or the chip(s). The semiconductor package includes a carrier and a shield structure in addition to the light emitter. The chip and at least part of the carrier are covered by the shield structure. The light emitter may be partially or fully covered or sealed by the shield structure. The light emitter may also be partially or fully exposed. The shield structure is such that the light provided by the light emitter sealed therein can pass therethrough to reach the outside thereof, thereby the states of the semiconductor package as a whole and/or the chip(s) can be recognized from the outside of the semiconductor package.
申请公布号 US2006071220(A1) 申请公布日期 2006.04.06
申请号 US20050237137 申请日期 2005.09.28
申请人 SILICONWARE PRECISION INDUSTRIES CO., LTD. 发明人 LU WEI LUNG;LIU CHENG JEN;CHANG CHIN-HUANG;CHANG YI-FENG
分类号 H01L31/12 主分类号 H01L31/12
代理机构 代理人
主权项
地址