| 摘要 |
A method for packaging a light emitting device, in which a primary light generator, such as a light emitting diode semiconductor die or laser diode, is attached to a lead frame and covered with a body of phosphor material so as to form a predetermined thickness of phosphor material covering the primary light generator. The body of phosphor material may be contained in a substantially transparent container or preformed, compressed disc. The resulting light emitting device has a primary light generator covered by phosphor material that is constrained to have a predetermined thickness.
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